1. Written Test
2. Technical Round
3. Communication Round
4. HR Round
this is a very god and easy process for fresher candidates. I got result same day, end of HR round. Offer letter was released after 15 days, but i was in touch with HR, they are very friendly.
Domande di colloquio [1]
Domanda 1
i did not remember but that are very simple question, anyone can answer.
Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso HP Inc. (Nuova Delhi) nel mese di gen 2019
Colloquio
Had 4 rounds of interview, technical, business analysis, case study, HR. Each round was conducted each day on conference. overall experience was good. Technical round was tough as i didnt had much experience in Python and SQL but managed with R skills
Domande di colloquio [1]
Domanda 1
Questions based on your resume and company you have worked with and wanted to join and the industry
Ho presentato la mia candidatura tramite segnalazione di un dipendente. La procedura ha richiesto 4 settimane. Ho sostenuto un colloquio presso HP Inc. (Palo Alto, CA) nel mese di mar 2016
Colloquio
1-2 rounds of phone interviews. Most interview questions are based on the research experiences and research projects. No coding interview and system design problems. It is not hard to prepare.
Domande di colloquio [1]
Domanda 1
Q: Describe the most important research project you did.
