Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso HP Inc. (Bengaluru) nel mese di ago 2021
Colloquio
First round is online test which consists of mcqs related to networking, operating system,DBMS and coding.
Second round interview, they asked networking, operating system and to write program.
Third round is managerial round.
Fourth round is HR round
Domande di colloquio [1]
Domanda 1
First round is online test which consists of mcqs related to networking, operating system,DBMS and coding.
Second round interview, they asked networking, operating system and to write program.
Ho sostenuto un colloquio presso HP Inc. (Vancouver, BC)
Colloquio
1 Round technical/behavioural. Mix of behavioural and technical questions. The technical portion of the interview featured no coding questions and mainly comprised of various trivia questions regarding standard computer science topics. Additionally, they also asked about previous experience in terms of internships and projects.
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto una settimana. Ho sostenuto un colloquio presso HP Inc. (Vancouver, BC) nel mese di giu 2024
Colloquio
Interview process consisted of a chat with two developers who work on the same team as I do. In the first half, they gave me an overview of the system they were working on. In the second half, they asked me to elaborate on a project that I worked on in my resume, followed by a basic leetcode question. It was overall a pretty chill process.
