Ho presentato la mia candidatura di persona. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso Hexagon nel mese di ott 2014
Colloquio
1.Written round ( consisting aptitude and C,C++,OOPS concepts)
2.Technical and HR interviews(logical interview if necessary)
Technical interviews : aptitude questions that were solved during the written test, were once again asked to be solved in front of the interviewers. Other questions were related to Mechanical engineering or any other stream eligible.
HR interviews : Varied questions for different candidates, mostly were Why intergraph ? Why not other company ? etc etc
Domande di colloquio [1]
Domanda 1
The most unexpected question was about my internship project. That was the most tough question rather, in the entire recruitment process. Rest was easy !
Interacted with SVP and the recruiter. No technical component aside from talking through resume. The recruiter was professional and timely. The SVP seemed to want employees who would work much more than 40+ hours, but I don't think he works there anymore.
Ho presentato la mia candidatura online. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso Hexagon (Huntsville, AL) nel mese di gen 2022
Colloquio
Laid back, questions about course experiences, how I began my engineering journey. Questions I had for the company, how my fellow students would describe my work ethic, my biggest flaw.
Domande di colloquio [1]
Domanda 1
What was a challenge you faced and how did you handle it
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Hexagon
Colloquio
College placement,open for all branches and mostly civil and mech core guys had applied as it matches their profile mainly,interview process was smooth and overall experience was fine.There was a aptitude test followed by tech interview and a final HR round.
Domande di colloquio [1]
Domanda 1
Few puzzles and algorithm and logic for some codes