Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso Hightech Next Engineering & Telecom (Calcutta) nel mese di gen 2025
Colloquio
The on call interview was so casual that they even don't want to test your knowledge they just need workers they ask 20000 as the joining amount and you should bring your own stamp paper for signing bond of 1 year.
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto una settimana. Ho sostenuto un colloquio presso Hightech Next Engineering & Telecom (Chennai) nel mese di apr 2025
Colloquio
Actually they mentioned technical exam and aptitude exam. But for us they directly took the phone call interview. 1st question is to introduce yourself, next question is tell me the types of topologies, what are the basic gates, universal gates and why, next is what is multiplexer and demultiplexer, types of modulation techniques. Basic hr questions
Domande di colloquio [1]
Domanda 1
Actually they mentioned technical exam and aptitude exam. But for us they directly took the phone call interview. 1st question is to introduce yourself, next question is tell me the types of topologies, what are the basic gates, universal gates and why, next is what is multiplexer and demultiplexer, types of modulation techniques. Basic hr questions
