Ho presentato la mia candidatura di persona. La procedura ha richiesto 3 settimane. Ho sostenuto un colloquio presso Honeywell (Hyderabad) nel mese di giu 2021
Colloquio
Interview had 3 rounds , all the three were technical rounds. Covered protocols, Board designing topics, Layout, Testing, Firmware , Thermal, SIL, MTBF, FMEA.
HR Round is mostly about salary negotiation.
