Ho presentato la mia candidatura tramite un selezionatore. Ho sostenuto un colloquio presso Huawei Technologies (Singapore) nel mese di nov 2024
Colloquio
Interview had 3 rounds. The first round is interview with team lead and members of the team. Mostly about technical questions, SQL, and LeetCode medium.
Second interview is with skip level manager, mostly about non technical questions. However I had a bad experience as this person did not pay much attention and played with his phone most of the time.
Last interview is with HR. Standard behavioural questions and administrative questions.
Ho sostenuto un colloquio presso Huawei Technologies (Kuala Lumpur)
Colloquio
There are 3 rounds of interviews. Everything went smooth and well organized. Mainly conduct in mandarin when interview with China team and ask about your past project experience and how you contribute to the work.
Domande di colloquio [1]
Domanda 1
Apache Spark related question (e.g. wha is is DAG in spark)
Ho presentato la mia candidatura online. La procedura ha richiesto 4 settimane. Ho sostenuto un colloquio presso Huawei Technologies (Shenzhen, Guangdong) nel mese di ott 2023
Colloquio
the first interview is coding online and solved some leetcode question by using local IDE sharing the screnn with interviewer.
And the next will be director and HR interview, all processes are online and use their meeting app. it is convenient.
