Ho presentato la mia candidatura di persona. La procedura ha richiesto 3 mesi. Ho sostenuto un colloquio presso Huawei Technologies (Ōsaka, Osaka) nel mese di gen 2020
Colloquio
4 rounds.
1. Hiring manager
2. HQ team leaders
3. HR interview
4. Consider from HQ to issue an offer letter.
Note that HQ can reject to issue an offer even Huawei in other countries already accepted.
Domande di colloquio [1]
Domanda 1
For the first interview, the most difficult question is to present a paper that we think is the most interesting.
For the second interview, questions are to test our skills at a higher level.
Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso Huawei Technologies (Helsinki, Finlandia meridionale) nel mese di mar 2025
Colloquio
I only attended the first interview. The HR had mentioned that this would be a resume walkthrough, and I don't have to prepare much, but it turned out to be a technical interview.
The interviewer was asking me MLOps and data engineering questions when my profile mentions no experience of those.
I never heard back from them after this first interview.
Ho sostenuto un colloquio presso Huawei Technologies (Singapore)
Colloquio
I was interviewed by the group leader and department leader, who asked about my previous project experiences, regarding which model or which method I used, and ended the interview process with an easy leetcode.
