La procedura ha richiesto 2 settimane. Ho sostenuto un colloquio presso Incedo (Santa Clara, CA) nel mese di giu 2019
Colloquio
Had three interviewers onsite. First guy was unprepared to ask interview questions. The next two guys were high level executives and did not ask hard technical questions. Current location does not even look properly staffed, people seen aren't actually based there. Got a low ball offer of 70K in the Silicon Valley.
Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso Incedo nel mese di feb 2026
Colloquio
I recently received an offer from Incedo Inc. for a Software Developer role with a client engagement at LPL Financial, and unfortunately, the hiring experience was quite disappointing.
The interview process felt unstructured. There was no clear scheduling, multiple times I received last-minute calls asking me to join interviews immediately, which made it difficult to plan.
When the offer was shared, the compensation did not match what had been discussed earlier. It was only after several follow-ups that this was corrected, without much clarity on why the discrepancy occurred.
The joining date was communicated as “tentative” and never clearly confirmed. Requests for an updated offer letter and timeline were not addressed, while at the same time I was being asked to proceed with onboarding documentation.
Overall, the process lacked clear communication and coordination, with a lot of back-and-forth and unresolved questions.
Ho sostenuto un colloquio presso Incedo (Hyderabad)
Colloquio
Interview consisted of two rounds, first was technical and after that HR. Both were as expected and went smoothly , just be confident and honest and you will clear it
Ho sostenuto un colloquio presso Incedo (Hyderabad)
Colloquio
The Incedo hiring process consists of three stages: first, an online written round with MCQs and coding questions; second, a technical interview focusing on DSA and SQL concepts; and third, an HR round emphasizing resume details, internships, and project discussions.