Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 4 settimane. Ho sostenuto un colloquio presso Infineon Technologies (Kulim) nel mese di feb 2024
Colloquio
FYP bonded internship. Phone interview,2 interviewers. They ask about mosfet, curricular activities you are active on and details on scopes of FYP and even graduation salary if you got this title.
Ho sostenuto un colloquio presso Infineon Technologies
Colloquio
very good experience. We have a good communication, and in this position I can combine my background and also try something new. I am very glad to have this opportunity.
Ho sostenuto un colloquio presso Infineon Technologies (Bengaluru)
Colloquio
There were 4 rounds; 3 technical rounds and 1 HR round. Each lasted for 30 to 40 minutes. Questions were based on C programming, Embedded C, microcontrollersand mainly and resume based questions were asked.
Domande di colloquio [1]
Domanda 1
What are the steps do you follow while debugging when the software is already been implemented onto hardware.
Ho sostenuto un colloquio presso Infineon Technologies (München, Bavaria)
Colloquio
Was alright. Basic questions about motivation, situational judgement and fit for the role.
Received answer pretty quickly, probably the position was a backfill and the interview was just for namesake and not actuality.