Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Intel Corporation
Offerta accettata
Esperienza positiva
Colloquio nella media
Candidatura
Ho presentato la mia candidatura tramite un'altra fonte. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso Intel Corporation (Chandler, AZ) nel mese di mar 2012
Colloquio
I was an intern last year for 3 months in a different group. So, they know my working style and commitment. The internship can be best described as 'devil is in the details' and your best bet to ask your coworkers to complete a given task rather than your manager.
Domande di colloquio [1]
Domanda 1
Describe the physics of the problem with a thermomechanical load on a chip. What alloy type (solder) needs to be considered?
Intern transition , so there was no interview. However I had to show my skills during internship, and internship interviews were relatively difficult. I accepted offer, as i loved my internship experience
Ho presentato la mia candidatura online. La procedura ha richiesto 3 settimane. Ho sostenuto un colloquio presso Intel Corporation (Hillsboro, OR) nel mese di mar 2019
Colloquio
An hour phone interview with the manager regarding job description, my background, and technical questions. An on-site interview which took a whole day. Interviewed by 8-9 manager/engineers in 1:1. Each interviewee observes your social interaction and tests your technical knowledge.
Domande di colloquio [1]
Domanda 1
semiconductor device basics (device operation, power/performance considerations), memory related questions since the position required knowledge on memory, reliability basics.
Ho presentato la mia candidatura di persona. Ho sostenuto un colloquio presso Intel Corporation nel mese di mag 2017
Colloquio
The phone interview is basically about the projects on the resume. Also some questions about semiconductors. It took about 40 minutes. After about two weeks, received an on-site invitation.