Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso Intel Corporation
Colloquio
Was invited to an interview on their facility. Initial meeting was friendly. They went straight into technical questions in another room with a whiteboard. Grilled me hard and poor reception.
Domande di colloquio [1]
Domanda 1
Asked 3-5 questions. The questions were beyond my skillset at that point in time. They took poor consideration in making applicable questions based on my skills. First two questions were about digital logic, which I had not taken. The last question was creating code about a deck of cards.
Ho sostenuto un colloquio presso Intel Corporation (San Jose, CA)
Colloquio
Pretty straightforward. Few technical questions, but focus is on behavioral traits. Took less than a month from interview to offer. Phone interview, then onsite interview with 4-5 people, including lunch break with potential colleague.
Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso Intel Corporation (Washington, DC)
Colloquio
It was easy although I had too much stress it was easier than I thought. It only required self-confidence and awareness. They are professional and I love the company's culture.
Ho presentato la mia candidatura online. La procedura ha richiesto una settimana. Ho sostenuto un colloquio presso Intel Corporation (Hillsboro, OR) nel mese di lug 2023
Colloquio
Semi Difficult - Interactive - Phone / Video interview - Technical - Overall skillset match - VLSI - PDK development - ASIC - Latest technology - Previous employment.
The interview process at Intel for an Application Engineer role in TD was a very well executed process. It was quick and simple. I sent my resume in conference to the director and also got a face-to-face (virtual in my case) interview. I went into as much detail as I could.
Domande di colloquio [1]
Domanda 1
ASIC / VLSI domain / Physical Design related questions