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      Intel Corporation

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      Ricerche correlate: Recensioni su Intel Corporation | Offerte di lavoro di Intel Corporation | Stipendi di Intel Corporation | Benefit di Intel Corporation
      Colloqui di Intel CorporationColloqui per Senior Packaging Engineer presso Intel CorporationColloquio di Intel Corporation


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      Colloquio per Senior Packaging Engineer

      11 feb 2019
      Candidato anonimo a colloquio
      Chandler, AZ

      Altre recensioni di colloqui per Senior Packaging Engineer presso Intel Corporation

      Colloquio per Senior Packaging Engineer

      6 nov 2015
      Candidato anonimo a colloquio
      Chandler, AZ
      Nessuna offerta
      Nessuna offerta
      Esperienza positiva
      Colloquio nella media

      Candidatura

      Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 4 settimane. Ho sostenuto un colloquio presso Intel Corporation (Chandler, AZ) nel mese di dic 2018

      Colloquio

      I interviewed with two teams back-to-back. The first team was Materials Technology Development with whom I interviewed from 8am-2pm including 1 hr of lunch in between. There was no presentation and all the interviews which lasted from 30 minutes- 1hr were focused on my PhD research. There was one technical round in which I was asked questions related to stresses in packaging. The second team was Module engineering with whom I interviewed from 2pm - 6pm including first 1 hour of my presentation. The questions in all the interviews from this team were completely behavioral.

      Domande di colloquio [1]

      Domanda 1

      How do you deal with stress? (Module Engineering)
      Rispondi alla domanda
      Esperienza negativa
      Colloquio difficile

      Candidatura

      Ho presentato la mia candidatura online. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso Intel Corporation (Chandler, AZ) nel mese di lug 2015

      Colloquio

      Onsite interview. But they never sent me an agenda. So on the interview day, I didn't even know when I would give a presentation or who would interview me or how many people I would expect to talk to. The interview started with one on one interview. (strange, isn't it?) After I interviewed with all managers and director, my host took me to another building to interview with VP. But VP didn't show up. So my host took me back and then I gave an 1 hour presentation to 3 people (my host, a manager and my HM). The manager asked me a lot of unrelated background questions. I don't work in that area. I don't know all the answers. But he kept asking even I told him I was not working in that area. HM was not even listening. Her computer had some problems that she could not even login. So she was dealing with that computer all time long till the end of my presentation. Very unprofessional! After I came back, I sent a thank you letter to everyone, but didn't hear back. After 4 weeks, I sent out a followup to HM, and didn't hear back. Another week later, I received a rejection email sent by the application system.

      Domande di colloquio [1]

      Domanda 1

      What is enthalpy
      Rispondi alla domanda
      1

      Colloquio per Senior Packaging Engineer

      17 lug 2015
      Candidato anonimo a colloquio
      Phoenix, AZ
      Nessuna offerta
      Esperienza neutra
      Colloquio nella media

      Candidatura

      Ho presentato la mia candidatura online. La procedura ha richiesto 2 settimane. Ho sostenuto un colloquio presso Intel Corporation (Phoenix, AZ) nel mese di giu 2015

      Colloquio

      Phone Interview, Followed by on-site, The whole process took 2 weeks. The onsite interview included 7 interviews in total, one after the other in a very busy schedule. They also ask me to do a one hour interview about my research. The interviewers were nice and friendly but the whole thing felt rush.

      Domande di colloquio [1]

      Domanda 1

      Tell me about your research
      Rispondi alla domanda