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      Intel Corporation

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      Ricerche correlate: Recensioni su Intel Corporation | Offerte di lavoro di Intel Corporation | Stipendi di Intel Corporation | Benefit di Intel Corporation
      Colloqui di Intel CorporationColloqui per Thin Films Module Engineer presso Intel CorporationColloquio di Intel Corporation


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      Colloquio per Thin Films Module Engineer

      29 mar 2019
      Dipendente anonimo
      Hillsboro, OR
      Offerta accettata
      Esperienza positiva
      Colloquio nella media

      Candidatura

      Ho presentato la mia candidatura tramite segnalazione di un dipendente. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso Intel Corporation (Hillsboro, OR)

      Colloquio

      1 hour phone screening. Interview day: 1. Meet with group leader. 2. Presenting my Ph.D work (1hr) to a group of people. 3. Individual interviews (1 hr per interviewer, total of 6) + Lunch (with group's engineers). 4. Fab window tour. 5. Wrap up with hiring chair.

      Domande di colloquio [6]

      Domanda 1

      Why apply for Intel?
      Rispondi alla domanda

      Domanda 2

      Experience with a certain equipment that I used in my Ph.D. work.
      Rispondi alla domanda

      Domanda 3

      What is the least thing I like during my Ph.D. study?
      Rispondi alla domanda

      Domanda 4

      More general questions about my presentation, technical or academic types.
      Rispondi alla domanda

      Domanda 5

      Conflict resolve with peers or adviser. Experience to work within a group.
      Rispondi alla domanda

      Domanda 6

      Ask them questions.
      Rispondi alla domanda
      3

      Altre recensioni di colloqui per Thin Films Module Engineer presso Intel Corporation

      Colloquio per Thin Films Module Engineer

      16 gen 2022
      Dipendente anonimo
      Portland, OR
      Offerta accettata
      Esperienza positiva
      Colloquio nella media

      Candidatura

      Ho presentato la mia candidatura tramite segnalazione di un dipendente. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso Intel Corporation (Portland, OR) nel mese di gen 2022

      Colloquio

      Had online interviews with 6 interviewers in Jan, 2022. It took me ~3 hours in the morning. The interviewers included 2 engineers and 4 group leaders. It covered technical and behavioral questions. And, it was going well.

      Domande di colloquio [1]

      Domanda 1

      What is your hand-on experience for a PVD chamber?
      Rispondi alla domanda

      Colloquio per Thin Films Module Engineer

      9 feb 2022
      Dipendente anonimo
      Hillsboro, OR
      Offerta accettata
      Esperienza positiva
      Colloquio nella media

      Candidatura

      Ho presentato la mia candidatura tramite segnalazione di un dipendente. La procedura ha richiesto 2 settimane. Ho sostenuto un colloquio presso Intel Corporation (Hillsboro, OR) nel mese di set 2021

      Colloquio

      The whole process was remote (online). Phase 1: Intel recruiter emailed me to apply for this position as I had been referred internally by an Intel employee, whom I met at a conference (perks of going to conferences). Then received an email from a senior team member for a phone interview which was about 45 minutes long, or maybe an hour long. It was mostly like a conversation, and occasional specific questions about my Ph.D. research, troubleshooting experiences, etc. Tip - Be excited when you converse, show great interest in the company and the role. It is all about convincing them why they should spend an entire day knowing you more. Phase2: About a couple of days later, the hiring manager from the team emailed to set up a whole day interview which consisted of seven 1-1 interviews (with the whole team - engineers, group leaders, and senior engineering manager), and a 1-hour presentation on the PhD work. All the interviews mostly focussed on what I did during my PhD, what kind of research equipment I worked with, why I did what I did, troubleshooting, experience with the advisor, fellow grad students, conflict resolutions with lab mates and advisor, safety protocols, grasp on research methodology. Tip: Identify different situations from your experience to address questions on these topics and be ready to recall them when asked, a lot of questions will be asked. Time was given after each interview to ask questions, so prepare a lot of questions - about the role, company, team, etc. Phase 3: After the interview, received an email for a background check after 2 days which was a good sign, and finally got the offer after a week of the interview.

      Domande di colloquio [1]

      Domanda 1

      Research experience, conflict resolutions, importance to safety, mistakes you made, what you learned from mistakes, working in a team, how to tell a senior/teammate that they are wrong!
      Rispondi alla domanda
      2

      Colloquio per Thin Films Module Engineer

      7 mar 2021
      Dipendente anonimo
      Hillsboro, OR
      Offerta accettata
      Esperienza positiva
      Colloquio nella media

      Candidatura

      Ho presentato la mia candidatura tramite segnalazione di un dipendente. Ho sostenuto un colloquio presso Intel Corporation (Hillsboro, OR)

      Colloquio

      A long but friendly interview. Started with a phone screen from an engineer which lasted about an hour. A month later, I was contacted to schedule the panel interview. On the panel interview day, I had 6 interviews with hiring manager, group leaders, fellow engineers etc. and my own research presentation. Questions were mostly from my presentation and resume on how I solved each problem, why did I choose particular techniques etc.

      Domande di colloquio [1]

      Domanda 1

      Troubleshoot instrument, conflicts with workers, a particular problem in your PhD that you had solved, when do you stop troubleshooting yourself and ask for help. Did you ever modify a machine ? Basics of SEM, CVD, XRD etc.
      1 risposta
      2

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