Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 4 settimane. Ho sostenuto un colloquio presso Intel Corporation
Colloquio
A phone screen interview was initially done before being invited to come in for an in person. The on-site Interview was done with the entire team, from the manager in addition to four other people. Only one of my interviews was very technical, the others more behavioral. Response to my results and offer post interview came within one week after the in person interview.
Domande di colloquio [1]
Domanda 1
How can IPC (instructions per clock) be improved in a processor
Ho sostenuto un colloquio presso Intel Corporation (San Jose, CA)
Colloquio
Pretty straightforward. Few technical questions, but focus is on behavioral traits. Took less than a month from interview to offer. Phone interview, then onsite interview with 4-5 people, including lunch break with potential colleague.
Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso Intel Corporation (Washington, DC)
Colloquio
It was easy although I had too much stress it was easier than I thought. It only required self-confidence and awareness. They are professional and I love the company's culture.
Ho presentato la mia candidatura online. La procedura ha richiesto una settimana. Ho sostenuto un colloquio presso Intel Corporation (Hillsboro, OR) nel mese di lug 2023
Colloquio
Semi Difficult - Interactive - Phone / Video interview - Technical - Overall skillset match - VLSI - PDK development - ASIC - Latest technology - Previous employment.
The interview process at Intel for an Application Engineer role in TD was a very well executed process. It was quick and simple. I sent my resume in conference to the director and also got a face-to-face (virtual in my case) interview. I went into as much detail as I could.
Domande di colloquio [1]
Domanda 1
ASIC / VLSI domain / Physical Design related questions