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      Intel Corporation

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      Ricerche correlate: Recensioni su Intel Corporation | Offerte di lavoro di Intel Corporation | Stipendi di Intel Corporation | Benefit di Intel Corporation
      Colloqui di Intel CorporationColloqui per PACKAGING R&D ENGINEER presso Intel CorporationColloquio di Intel Corporation


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      Colloquio per PACKAGING R&D ENGINEER

      4 nov 2019
      Candidato anonimo a colloquio
      Chandler, AZ
      Nessuna offerta
      Esperienza neutra
      Colloquio nella media

      Candidatura

      Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso Intel Corporation (Chandler, AZ) nel mese di set 2019

      Colloquio

      I applied through my University's job application portal: Handshake and was called the next day for a phone screen directly by the Hiring Manager. After a week, I was invited on-site at Intel, Chandler for a day-long interview. It was scheduled from 9 am to 5 pm, meeting 1:1 with 2 mechanical engineering team leads and 3 senior engineers with several breaks in between. There were 4 other candidates interviewing that day. The 1:1 interviews were a mix of behavioral and technical questions, mostly asking about my previous experiences and things on my resume. The technical questions were mechanical engineering-related: stress-strain curve, heat transfer, CTE, DOE, Statistical Analysis, DFM, Structural Mechanics, FEA and injection molding. Most of the questions were testing problem-solving ability and how one thinks out of the box. The last 1 hour was scheduled for a Solidworks test, in which, I was given an isometric view of a tool holder to be designed as a 3D model, followed by assembly and 2D drafting and dimensioning. Ask several questions along the way, if you get stuck, ask. The design test was really interesting and was geared to test one's comfort with Solidworks, how one dimensions, and the use of correct steps to achieve an efficient output (Least number of clicks and keystrokes). Negatives: It was a great experience overall, everyone there was positive and cheerful. However, after the interview, it took them 1 month to send a rejection email, that too an automated one with no feedback. When asked for feedback, no one replied. I was asked to fill out a reimbursement form to cover the travel for the interview, but, never got the reimbursement. Not that I care about the reimbursement, but no feedback is very unprofessional.

      Domande di colloquio [7]

      Domanda 1

      What is CTE Mismatch? How can it be avoided?
      Rispondi alla domanda

      Domanda 2

      Draw and explain the Stress-Strain curve.
      Rispondi alla domanda

      Domanda 3

      Draw and explain an SFD and BMD for a simply supported beam.
      Rispondi alla domanda

      Domanda 4

      What is Root Cause Analysis and explain your project?
      Rispondi alla domanda

      Domanda 5

      Given the choice of Flathead and Philips head screw, which would you select? What are the advantages and disadvantages of both?
      Rispondi alla domanda

      Domanda 6

      What are some DFM considerations when designing for Injection Molding?
      Rispondi alla domanda

      Domanda 7

      Which material would you select if the product needs to have a high cosmetic value, needs to be hard and have the ability to withstand constant thermal cycling?
      Rispondi alla domanda
      1

      Altre recensioni di colloqui per PACKAGING R&D ENGINEER presso Intel Corporation

      Colloquio per PACKAGING R&D ENGINEER

      27 apr 2022
      Dipendente anonimo
      Offerta accettata
      Esperienza positiva
      Colloquio nella media

      Candidatura

      Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso Intel Corporation

      Colloquio

      The team was very friendly but asked keen questions from my resume. The hiring manager mostly asked questions about my fit for the position. Very constructive interview with lots of learning.

      Domande di colloquio [1]

      Domanda 1

      What exactly do you expect for this role?
      Rispondi alla domanda

      Colloquio per PACKAGING R&D ENGINEER

      28 feb 2022
      Dipendente anonimo
      Offerta accettata
      Esperienza positiva
      Colloquio nella media

      Candidatura

      Ho sostenuto un colloquio presso Intel Corporation

      Colloquio

      Initial phone call interview, was described the position and asked a few questions relating to knowledge of polymer science and instrumental analysis. Then was allowed to ask a few questions back to the interviewer.

      Domande di colloquio [1]

      Domanda 1

      Strengths and weaknesses? Describe an instrument, how it functions?
      Rispondi alla domanda

      Colloquio per PACKAGING R&D ENGINEER

      22 feb 2022
      Dipendente anonimo
      Offerta accettata
      Esperienza positiva
      Colloquio nella media

      Candidatura

      Ho sostenuto un colloquio presso Intel Corporation

      Colloquio

      1. 1 st round is a 30 min phone screening 2. 2nd round is an 1h presentation on research and nine 1:1 sessions. most questions are about presentation. also ask a lot of behavior questions.

      Domande di colloquio [1]

      Domanda 1

      1. why do you want this job
      Rispondi alla domanda

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