Ho presentato la mia candidatura tramite segnalazione di un dipendente. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso Intel Corporation (Chandler, AZ) nel mese di mar 2012
Colloquio
I submitted my resume in the system, and I got a phone interview with an engineering in 30 minutes regarding my research. After I passed a phone interview, I got on-site interview. There are three other candidates with different engineering backgrounds. We took turns to interview with 4 team members and finally got an interview with a hiring manager. After all interviews were done, and we presented our research to the team members. It was a day-long process.
Domande di colloquio [1]
Domanda 1
Difficult questions were coming from the current technical issues they had been experiencing in the process. Basically, how can we dispose polymer in the packaging process when certain sets of devices and conditions were given? The velocity of a dispenser and the amount of polymer are key outcome while varying temperature, viscosity, and configurations of polymer. You have to know about the relationship between viscosity and force and the characteristics of polymer. Another important thing that you should remember is how temperature is affecting the shear force of polymer. There are rare happenings of brimming over the die package specification. You should know about why it is happening, how you can handle it, and what might be the solution techniques at least in a brief format.
Ho sostenuto un colloquio presso Intel Corporation
Colloquio
Very easy interview process. It took 3 months to get the offer. great work experience, poor management. strict deadlines. stressful, no work life balance, low salary, poor communication between upper management and engineers. lots of office politics
Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso Intel Corporation nel mese di mag 2024
Colloquio
The manager emphasized questions about teamwork and collaboration, since my technical expertise had already been demonstrated and was not a concern during the interview process. The manager and his colleague took turns asking questions.
Domande di colloquio [1]
Domanda 1
How do you resolve conflict, how do you prioritize projects, how do you mentor and train junior engineer?,...
Ho presentato la mia candidatura online. La procedura ha richiesto 2 mesi. Ho sostenuto un colloquio presso Intel Corporation (Kuala Lumpur) nel mese di ott 2022
Colloquio
Virtual interview with the Director and Hiring Manager and it took almost one hour. They were looking for equipment engineer for their new process. Mostly talking about how I could contribute.
