Ho presentato la mia candidatura online. La procedura ha richiesto 4 settimane. Ho sostenuto un colloquio presso Intel Corporation (Folsom, CA) nel mese di ott 2009
Colloquio
The interview process consisted of a phone interview followed by an on-site interview.
The phone interview asked a few technical questions about semiconductor physics, digital logic, and digital circuit design.
The on-site interview was a series of 1:1 interviews throughout a ~7-hour period. They asked questions in the same categories as before with the addition of systems design questions.
Domande di colloquio [1]
Domanda 1
Asked to describe the change in a graph of a transistor based on Vds changes.
Ho sostenuto un colloquio presso Intel Corporation
Colloquio
There were four interviews. The first one was a initial screen over the phone interview going over job expectations like relocation and salary. The next three were reasonable technical interviews.
Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso Intel Corporation (Hillsboro, OR) nel mese di set 2022
Colloquio
The interview process is easy and each next step is clear. It starts with HR, technical interview and then interview with management. To start this process you need to answer a questionnaire on their site
Domande di colloquio [1]
Domanda 1
My previous experience: field of work and responsibilities
Ho presentato la mia candidatura online. La procedura ha richiesto 2 settimane. Ho sostenuto un colloquio presso Intel Corporation (Hillsboro, OR) nel mese di set 2021
Colloquio
the process was smooth. I had a phone interview with the hiring manager two weeks later I had a panel interview online with the hiring manager and two other engineers
Domande di colloquio [1]
Domanda 1
2 behavioral questions
logic gates (NOR gate and Full Adder Circuit)
1 programming question
1 data analysis question
