There were 4 rounds, learnt new perspectives from each round, I was doing good till the semi tech round(round 3). They except to know the approach for a problem more than the code implementation.
Domande di colloquio [1]
Domanda 1
Round 1:strings and arrays
Round 2 may differ
Round 3:Graph based on dynamic programming
Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso KLA (Singapore) nel mese di apr 2026
Colloquio
HR started a friendly call and email interview set-up with the hiring team in a week. But from there, everything went downhill. HR asked for my past payslips in the beginning and I wasn't even interviewed yet. It was the first redflag. Then, HR gets quiet after receiving my expected salary. The interview itself was the worst. The interviewer was distracted, kept thinking and mumbling about her meetings. She was not a true software engineer because she couldn't accept that there can be multiple solutions to a problem.
Domande di colloquio [1]
Domanda 1
Example code review and application development concepts
Ho presentato la mia candidatura tramite un'agenzia di reclutamento personale. Ho sostenuto un colloquio presso KLA (Migdal Ha`Emeq) nel mese di gen 2026
Colloquio
The interview was a group interview, I was interviewed twice. The first interview was easy with two problems that I had to solve. The second interview was with a team manager, half in English.
Domande di colloquio [1]
Domanda 1
Write a function in C that accepts a byte and returns how many ones there are in one byte.
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso KLA (Coimbatore) nel mese di dic 2025
Colloquio
We had a hackathon for two days in which iterative shortlistings was done to select the people. Before this, a basic coding round where 2 questions were asked. Those who were shortlisted went into the hackathon process. Two rounds of hackathon spanned over 2 days happened and the results were announced at the end of day 2.
Domande di colloquio [1]
Domanda 1
They asked a hackathon question that involved wafers and dies - based on semiconductor industry.