First interview had a quick phone call. Simple questions about debugging, what would you do in x scenario, what have you done in the field. No technical questions asked in the first inverview.
Domande di colloquio [1]
Domanda 1
What would you do if a manual had incomplete documentation?
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 2 settimane. Ho sostenuto un colloquio presso Microchip (Silchar) nel mese di mag 2023
Colloquio
There were 3 rounds in the process. The first round was screening of the resumes of all the applied candidate. The second round was technical interview which lasted for around 1 hour. Main topics asked are C/C++ and OOPS. The last round was HR Round which lasted for 15 min and asked about relocation.
Domande di colloquio [1]
Domanda 1
What is difference between run time and compile time polymorphism?
Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso Microchip (Bengaluru)
Colloquio
Smooth interview. Happened online interview. Three rounds of interview were there. One round of written test, two rounds of technical tests.
Sta, physical design, asic design flow, digital, complementary metal oxide semi conductor questions.
Domande di colloquio [1]
Domanda 1
Smooth interview. Happened online interview. Three rounds of interview were there. One round of written test, two rounds of technical tests.
Sta, physical design, asic design flow, digital, complementary metal oxide semi conductor questions.