Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Microchip Technology (Hyderabad) nel mese di giu 2023
Colloquio
I applied through campus placement. The process took 2 weeks and composed of 3 rounds.
1. Technical Test
2. Technical Interview
3. HR interview
Those who cleared the first round will get call for round 2 and 3.
Domande di colloquio [1]
Domanda 1
Basics questions on digital electronics (focusing on sequential circuits), programming knowledge (C and Verilog). And they might ask questions on static timing analysis, microprocessors etc.
