Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 2 mesi. Ho sostenuto un colloquio presso Micron Technology (Boise, ID) nel mese di set 2016
Colloquio
3 half-hour phone calls and one-day on-site interview. 1st phone screen is by HR with elevator pitch and common behavior questions. 2nd phone call is by the hiring manager, with 50% technical questions about your own research, 30% about the job you're applying and 20% behavior. 3rd phone call by 2 other team members with questions similar to last phone call. After passing the phone interviews, you will be invited to Boise for on-site. 1 45-minute presentation with 6 interviews. You will get a lot of technical questions and behavior questions
Domande di colloquio [1]
Domanda 1
How does MOSFET work? What are the challenges in semiconductor industry
Ho sostenuto un colloquio presso Micron Technology
Colloquio
The interview was conducted online via Zoom and lasted around 40 minutes. Only one interviewer was present during the session. The questions were manageable and mainly focused on my background, experiences, and interest in the role.
Domande di colloquio [1]
Domanda 1
They asked me to share about my project experience.
Ho sostenuto un colloquio presso Micron Technology
Colloquio
It was a campus hiring event and only general questions were asked: such as about my project and coursework. It was a very interactive session and all, making me want to start my career in Micron.
Domande di colloquio [1]
Domanda 1
You don't specialise in semiconductors and don't have any experience in the field, still why do you want to join us?
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Micron Technology nel mese di feb 2025
Colloquio
Logic & Aptitude Test (30 mins, 25 questions):
A timed test assessing problem-solving, analytical thinking, and pattern recognition. It includes logic puzzles and scheduling constraints.
First-Round Interview (Technical Interview):
A panel of engineers will test your semiconductor knowledge, including process development, data analysis (SPC, DOE, FMEA), and troubleshooting manufacturing issues. Some basic coding and automation-related questions may also be asked.
Second-Round Interview (Behavioral & Team Fit):
A more in-depth discussion with senior engineers or managers, focusing on leadership, collaboration, and adaptability. Expect scenario-based questions about handling challenges in a fast-paced environment.
Domande di colloquio [1]
Domanda 1
What were your past projects like? What was your FYP about?
