Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso Micron Technology (Boise, ID) nel mese di nov 2011
Colloquio
I met with a recruiter at my college, and was given two technical questions. I did both of these, and got a phone call about a week later inviting me out to an on campus interview. They flew me out the day before the interview and put me in a hotel downtown. I met with an HR person, and was escorted to the first of five hiring managers, each one leading to the next. Each hiring manager asked me two to three technical questions, plus one or two soft questions. The whole process took about 3 hours. I felt like I nailed most of the technical questions, but alas, no offer.
Domande di colloquio [1]
Domanda 1
Given: three clamped NMOS transistors in series with Vcc at the beginning. The output of the final one went into the source of a PFET, with the drain tied to ground and the gate tied to some voltage, I forget exactly what. I was asked to label the voltage at each node, and then which state the PFET was in.
Ho sostenuto un colloquio presso Micron Technology (Boise, ID)
Colloquio
python questions, CMOS circuit, inverter graph, basics of semoconductor physics list dictionary and tuple in python and basics of OOP, be ready to talk about your projects and how it related also why you like this specific role
Domande di colloquio [1]
Domanda 1
how do u solve this digital cmos circuit whats the output?
Ho sostenuto un colloquio presso Micron Technology (Singapore)
Colloquio
All communications with HR via emails. Interview Online via zoom. Many managers and higher ups attending the zoom meetings. Total of 4 people. Not much concern on setting up the schedule.
However just be ready, after interview there’s no follow-up, not even a standard rejection email.
Domande di colloquio [1]
Domanda 1
Previous experience. Motivation to join the company.
Ho sostenuto un colloquio presso Micron Technology
Colloquio
There are 3 rounds: first, a round with the Hiring Manager, followed by 2 Technical rounds conducted by the team members. If you pass these, there will be a follow-up HR round.
Domande di colloquio [1]
Domanda 1
- Basics of memory devices (e.g., DRAM, NAND, etc.)
- SA circuit debugging
- Questions related to your previous work experience
- Fundamentals of semiconductor fabrication
- Basic coding questions
