Ho presentato la mia candidatura tramite segnalazione di un dipendente. La procedura ha richiesto 4 settimane. Ho sostenuto un colloquio presso Micron Technology (Taichung) nel mese di gen 2024
Colloquio
3 phone interviews each lasting for at least 75 minutes, Interviewee needs to show capability and practical experience in the semiconductor industry.
Qualification and Skills:
• Knowledge in Micro Electronic Packaging, Quality and Reliability Engineering and Failure Analysis are preferred.
• Knowledge of materials properties, applications, and materials characterization.
• Experience in memory or related products in assembly, testing or reliability preferred.
• Experience in data analysis and reliability modelling will be preferred.
Domande di colloquio [1]
Domanda 1
Tell me about yourself.
What attracted you to apply for this position?
Describe a challenging situation at work and how you handled it.
How do you prioritize and manage your time in a fast-paced environment?
What are your strengths and weaknesses?
Can you provide an example of a successful project you've worked on in the past?
How do you stay updated on industry trends and advancements?
Tell me about a time when you had to work with a difficult team member. How did you handle it?
What skills do you think are essential for this role, and how do you possess them?
Where do you see yourself in 5 years?
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 2 giorni. Ho sostenuto un colloquio presso Micron Technology (Atlanta, GA) nel mese di gen 2019
Colloquio
On campus interview. The overall process was casual. I talked to the hiring manager at a campus career fair and got contacted that evening to schedule an interview the day after.
Domande di colloquio [3]
Domanda 1
How to increase gate voltage without changing the physical dimensions, materials, etc. of a mosfet
