The interview process was good and professional. The first round was screening round where you just introduce yourself. Then second round is a machine test round where you will get an assignment to complete. The third round is a technical round and last round will be verbal round with ceo.
Domande di colloquio [1]
Domanda 1
They asked me about bug, defect, SDLC, STLC and find bugs in a UI during technical round.
