Ho presentato la mia candidatura tramite un'altra fonte. La procedura ha richiesto 4 settimane. Ho sostenuto un colloquio presso Native Instruments (Los Angeles, CA) nel mese di mar 2011
Colloquio
I was contacted via LinkedIn by the hiring manager, who would also be my direct supervisor and project manager. The LinkedIn correspondence led to a phone interview the next day. This was followed by a video conference at the company location with a peer panel in Berlin. Following brief negotiations with HR, an offer was made in under a month.
Domande di colloquio [1]
Domanda 1
No single question was difficult - just standard questions from peer mechanical engineers seeking to gauge my expertise in plastic part and consumer electronics design. These included what plastic to use for structural part; what's best plastic for high cosmetic quality; wall thickness to boss and rib ratio; how I integrate PCBA data into 3D CAD environment.
