Ho presentato la mia candidatura tramite un selezionatore. La procedura ha richiesto 3 settimane. Ho sostenuto un colloquio presso Oracle Engineering Group nel mese di set 2013
Colloquio
3 phone interviews. 1st one was about device physic, capacitance in drain source and gate, leakage current in several circuit. 2nd about verilog, some basics. 3rd about SRAM and dynamic circuit, I guess because I had some experience on these, mostly about power issues. Lots of details but nothing out of normal.
Domande di colloquio [1]
Domanda 1
Asked me a lots of leakage and power. Not really prepared for that.
Ho sostenuto un colloquio presso Oracle Engineering Group
Colloquio
At first, a phone interview with 1 hour and all basic digital circuits questions, also included some computer architecture questions. Then a on-site interview, it took 4 to 5 hours and questions focus on the time constraints.
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso Oracle Engineering Group (Los Angeles, CA) nel mese di nov 2011
Colloquio
The manager asked me about my resume and some projects I've done before. After that, he kept asking me some general digital circuit's problem, like power consumption and the delay.