Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso Pricol
Colloquio
It was a campus placement for me. Totally 4 rounds were conducted instead of 5 rounds due to time constraint. First round was a technical round in which they asked the basic mechanical engineering questions. second one was aptitude of about 2 papers, one is quants and other is pictorial aptitude in which I topped :P. Third round was personal interview where they asked about our last year project, course work related on product development, how we did our interns, some basic questions on engineering, physics laws etc.. Fourth one was on CAD skill. We were given with a model to replicate same in creo and convert the same to 2D drawing.
Domande di colloquio [1]
Domanda 1
I didn't find any difficult question except questions related to electronics like what is present technology in PCB soldering etc.
Ho presentato la mia candidatura di persona. La procedura ha richiesto 2 giorni. Ho sostenuto un colloquio presso Pricol (Coimbatore) nel mese di gen 2017
Colloquio
On campus they recruit to develop an android application for a hardware they are manufactured and also firmware.Shortlisted the students by their resume and interview is conducted separately they offered me the intern ship.
Ho presentato la mia candidatura tramite segnalazione di un dipendente. Ho sostenuto un colloquio presso Pricol (India, TN) nel mese di mar 2011
Colloquio
First of all objective type questions,Secondly model test.After that face to face interview,technical interview and hr inteview.I was very bold when I was answer each and every questions because I was working as lecture also due to this reason I didn't get any tension when I was answering the questions