Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Qualcomm (Nuova Delhi) nel mese di ago 2017
Colloquio
It was an on campus placement opportunity, first they took a 1.5 hr test on hire-pro for both hardware and software profile.
After that 15-20 candidates were shortlisted for the hardware domain.
We were called for the interview process.
In first round , they asked about programming and basic digital electronics although i applied for the hardware profile only.
After that some of us were called for the second round.
A long discussion on my resume and my projects happened.
After that he asked me to design a FSM of some real world problem.
Asked the basic of STA.
After that in third round , the interviewer dive deeper in STA . He gave me a circuit and asked me to find setup and hold violation etc etc.
Ho presentato la mia candidatura tramite segnalazione di un dipendente. Ho sostenuto un colloquio presso Qualcomm (Hod HaSharon) nel mese di mag 2026
Colloquio
3-Stages,i only did the first one. they asked about grades,project i did, and asked my to explain and draw the design for my final project. after that, ive been asked a few questions.
It was on campus hiring. It consists of an online assessment and resume screening, followed by 3 rounds of interviews, out of which 2 were technical and 1 was HR.
Ho presentato la mia candidatura tramite un selezionatore. Ho sostenuto un colloquio presso Qualcomm (Hsinchu)
Colloquio
The interview process spanned 4 days with one 1–2 hour session per day. Each round began with a 30-minute discussion on my college projects, followed by deep dives into Computer Architecture (CPU Design, Cache ＤDesign, etc.). One of the sessions also included a simple whiteboard coding question.
Domande di colloquio [1]
Domanda 1
Cache Design (calculating cache bits involves breaking down the CPU address into Tag, Index, and Offset field)