Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 2 giorni. Ho sostenuto un colloquio presso Qualcomm nel mese di set 2020
Colloquio
Mainly consist of 3 rounds.
1. Written round
2. Technical interview
3. HR interview
Written round consist of 3 sections first one is aptitude second is coding and third one is technical. Questions are from c programming data structure operating system verilog digital electronics mosfet etc.
Domande di colloquio [1]
Domanda 1
There are 2 technical interview mainly focused on projects written in resume and areas of interest like cmos etc.
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Qualcomm (East Godavari) nel mese di set 2020
Colloquio
The hiring process contains online test and technical interview followed by hr interview. The online test was easy.it contains basic c programming questions and core questions.technical round was little bit difficult
Domande di colloquio [1]
Domanda 1
Tell about Moore and mealy machines.sequence detectors
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Qualcomm (Allahabad) nel mese di ago 2019
Colloquio
Qualcomm came to my campus. First is multiple-choice question round. The second thing is the technical round based on digital knowledge. after clearling that 2nd techical round bases on programming languages
