Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Qualcomm (Kozhikode, ) nel mese di ago 2021
Colloquio
There were 3 rounds 2 technical rounds and 1 hr. round . Every round is elimination type , the person clearing the 1st round will go to the 2nd round , and the person clearing the 2nd will go for the hr round. Good technical question from digital electronics chapter most focused are Boolean algebra, sequential circuit, fsms, Verilog ,Computer architecture, C programming , cmos . Setup time , hold time ,synchronous set , reset
1
Esperienza neutra
Colloquio difficile
Candidatura
Ho presentato la mia candidatura tramite segnalazione di un dipendente. Ho sostenuto un colloquio presso Qualcomm (Hod HaSharon) nel mese di mag 2026
Colloquio
3-Stages,i only did the first one. they asked about grades,project i did, and asked my to explain and draw the design for my final project. after that, ive been asked a few questions.
It was on campus hiring. It consists of an online assessment and resume screening, followed by 3 rounds of interviews, out of which 2 were technical and 1 was HR.
Ho presentato la mia candidatura tramite un selezionatore. Ho sostenuto un colloquio presso Qualcomm (Hsinchu)
Colloquio
The interview process spanned 4 days with one 1–2 hour session per day. Each round began with a 30-minute discussion on my college projects, followed by deep dives into Computer Architecture (CPU Design, Cache ＤDesign, etc.). One of the sessions also included a simple whiteboard coding question.
Domande di colloquio [1]
Domanda 1
Cache Design (calculating cache bits involves breaking down the CPU address into Tag, Index, and Offset field)