Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 2 settimane. Ho sostenuto un colloquio presso Qualcomm (Kānpur, Uttar Pradesh) nel mese di dic 2023
Colloquio
It was campus interview. Questions from thesis, project, STA, digital IC design, puzzles were there.
FIFO, 2 flop synchronizer, clock domain crossing. Different types of power in CMOS, how to minimize them.
Domande di colloquio [1]
Domanda 1
What is fifo? importance? full empty condition? two flop synchronizer?
It was on campus hiring. It consists of an online assessment and resume screening, followed by 3 rounds of interviews, out of which 2 were technical and 1 was HR.
Ho presentato la mia candidatura tramite un selezionatore. Ho sostenuto un colloquio presso Qualcomm (Hsinchu)
Colloquio
The interview process spanned 4 days with one 1–2 hour session per day. Each round began with a 30-minute discussion on my college projects, followed by deep dives into Computer Architecture (CPU Design, Cache ＤDesign, etc.). One of the sessions also included a simple whiteboard coding question.
Domande di colloquio [1]
Domanda 1
Cache Design (calculating cache bits involves breaking down the CPU address into Tag, Index, and Offset field)
Ho sostenuto un colloquio presso Qualcomm (Bengaluru)
Colloquio
The interviewer was friendly and created a supportive atmosphere. They offered constructive hints when I got stuck, showing they were focused on my thought process, which made for a positive experience.
Domande di colloquio [1]
Domanda 1
They asked questions on STA,my projects, Verilog case statements
