Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Roop Ultrasonix Ltd (Mumbai) nel mese di apr 2017
Colloquio
The interview process consisted of 1 Aptitude test, 2 HR rounds, 1 Technical Round and finally the GM interview. The process took 2 days to complete.The Aptitude test was easy. Please prepare thoroughly for the technical interview as the concepts needs to be very much clear for having a good score in technical interview here.
Ho sostenuto un colloquio presso Roop Ultrasonix Ltd (Andheri East)
Colloquio
1. task to write an essay, 2. HR round - resume and about yourself, sell something, 3. Sales head/team lead - questioned about background, why this role, knowledge about product, expectation from team and employer, explained job role.
Domande di colloquio [1]
Domanda 1
What is your family background, why this role, knowledge about product, expectation from team and employer
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Roop Ultrasonix Ltd (Andheri) nel mese di mar 2017
Colloquio
There were 4 rounds of selection
1. Aptitude and Essay writing
2. HR interview (My Interview lasted for 30min-45min. the question was very basic like about our strength, etc. )
3. Technical
4. GD
Topic for GD was 1. Smart work or Hard work.