Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso SLB (Berkeley, CA) nel mese di ott 2016
Colloquio
the interview took place on campus and it was 30 min. they asked me to explain some unusual physics and machining problems. the questions had simple answers and quite intuitive but they were interested in how you come up with the answers. they asked specific questions about the campus faculties as well... then they asked me behavior questions based on the resume.
Domande di colloquio [1]
Domanda 1
describe a team that you don't like and how you overcame the conflict.
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 4 settimane. Ho sostenuto un colloquio presso SLB (Houston, TX) nel mese di mar 2019
Colloquio
Two interviews:
first behavioral in university
second technical (two-day process) in Houston - 10-minute presentation (7 min presentation and 3 min for questions by the panel on the said presentation) and 4 personal interviews(45 minutes each with 15 min breaks in between)
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso SLB
Colloquio
Two rounds. First round on campus, 1-1 with HR. Second round in Houston, group interview with several other candidates, starting with a 7-minute presentation followed by 4 rounds of 1-1 technical interviews.
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto una settimana. Ho sostenuto un colloquio presso SLB (Indianapolis, IN) nel mese di feb 2017
Colloquio
Interacted with the representative at the college career fair and got an on-campus interview the next day which lasted 30 mins. A week later, I was notified of being selected for the second round at Houston. The interviewer was easy to talk with, asked to explain a project from the resume, asked basic behavioural questions
Domande di colloquio [1]
Domanda 1
why Schlumberger, give an example of conflicts while working in a team and how you resolved it, etc.
