Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso SLB (Agartala) nel mese di ott 2023
Colloquio
focussed on strength of materials ,your internship,your projects,and why do you want to join slb.Not tugh but basic questions from thermodynamics,fluid mechanics may be asked like 3rd law of thermodynamics
Domande di colloquio [1]
Domanda 1
focussed on strength of materials ,your internship,your projects,and why do you want to join slb.Not tugh but basic questions from thermodynamics,fluid mechanics may be asked like 3rd law of thermodynamics
It was a good interview experience with multiple rounds, including OA, GD, Technical interview, HR round. While the OA round was quite easy including questions from analog electronics and some questions on gates, it also comprised of easy logical and english based questions. The GD round was easy as well.
Domande di colloquio [1]
Domanda 1
They mostly asked about electronics basics and we discussed about the projects on the resume
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso SLB (Vellora) nel mese di lug 2019
Colloquio
Introduction session about the company and their operations. Then shortlisted students based on the university cgpa. Then hr plus technical interview with one hr and one tech lead. They asked about analog and digital circuits including graphs and outcomes
Domande di colloquio [1]
Domanda 1
About me, eee questions like analog and digital electronics, circuits
