Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 2 giorni. Ho sostenuto un colloquio presso Siemens (Poona) nel mese di ott 2023
Colloquio
2 Interview Rounds
both technical
in round1 it includes basic working easy questions of Leetcode and 1 puzzle question
in round 2 they asked 1 prime number question and 1 puzzle question. Some resume-based questions.
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Siemens (Airoli)
Colloquio
The first round of interview consists of an Aptitude + Technical Test round which consists of basic verbal communication English aptitude and the technical round consist of question related to electronics and circuitry followed by a face-to-face interview in the office Airoli and the 2nd Round was of HR round
Domande di colloquio [1]
Domanda 1
what is a transformer what is its efficiency? what is present in the laptop charger or any other charger? what is series and parallel connections and state the ohms law?
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Siemens (Bengaluru)
Colloquio
Good process. Starting with aptitude round followed by interview. You need to be through with your academics. Aptitude was of moderate difficulty. A basic practise from Arun sharma will do the job.