Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 2 giorni. Ho sostenuto un colloquio presso SignOff Semiconductors (Mangalore) nel mese di mar 2023
Colloquio
Three Rounds in the interview process.
First-round was MCQs (electronics topics) basic electronics, digital logic, VLSI concepts, and a few numerical problems.
2nd round technical interview. Digital logic design, VLSI, analog topics.
3rd HR interview
Domande di colloquio [1]
Domanda 1
Explain different types of flip-flops and their working.
Questions on multiplexers and IC fabrication.
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 3 giorni. Ho sostenuto un colloquio presso SignOff Semiconductors (Bengaluru) nel mese di mar 2023
Colloquio
It was a very good experience. The interviewers were very professional and the interview went quite smooth. They asked many basic questions and it was very interactive. I was very happy with the process.
Domande di colloquio [1]
Domanda 1
Basic questions related to Digital Design, Analog Electronics, CMOS fundamentals.
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso SignOff Semiconductors (Bengaluru) nel mese di mar 2023
Colloquio
Good. Applied through pool campus placement process. The process took place in 2 days . First round is written test. It included aptitude,verbal, logical reasoning and electronics questions. Each wrong answer had -1 mark and right answer +1. Next two round of interviews. Technical and HR. Interviewers were nice and kind.
Domande di colloquio [1]
Domanda 1
Basics of electronic. Digital electronics. Analog circuits. VLSI questions
