Ho sostenuto un colloquio presso SmartDV Technologies
Colloquio
Round 1 : Written test
Round 2 : Technical interview - I
Round 3 : Technical interview - II
Round 4 : Technical interview- III ( May/ May not be)
Round 5 : HR interview
Domande di colloquio [1]
Domanda 1
Written Test :
The written test consist of questions from aptitude, digital electronics, electronic circuits, C programming , MPMC and other core subjects related to electronics
Round 2, 3 & 4:
Interview questions are based on digital electronics, verilog, C programming and other core related concepts
Round 5:
General HR questions like whether agreeing for bond or not..etc
La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso SmartDV Technologies
Colloquio
The whole process took a day. First round is written test that consists of digital, analog, microprocessor, c++ and aptitude questions.
The second is the technical interview. It is based on the area of interest and C/C++ concepts with more questions in digital domain.
The third round is CEO round, which is like a general HR round.
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso SmartDV Technologies nel mese di dic 2015
Colloquio
The interview took one day..among 250 candidates only 3 were selected. The HR was only concerned on the candidates acceptance for 4 years bond. They checked our personal background and guessed whether the family will send the candidate or not.
1st round - written - aptitude and technical questions(digital electronics based)
2nd round - face to face technical(digital electronics based)
Domande di colloquio [1]
Domanda 1
1.multiplexers (mostly digital electronics topics)
