Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso SmartDV Technologies (Virudhunagar) nel mese di dic 2024
Colloquio
The process is of 4 rounds
1.Writtern Exam ,
2.Technical Round - 1
3. Technical Round - 2
4. Technical Round - 3
1. Written Exam: Consists of 10 Aptitude Questions and some Core Questions of BJT,MOSFET
Domande di colloquio [1]
Domanda 1
1. Basic Verilog Questions
2.Digital Electronics
3.C , C++
Ho sostenuto un colloquio presso SmartDV Technologies (Sivakasi)
Colloquio
Round 1: MCQ on paper with basic A and D electronics.
Round 2, Round 3: virtual meeting with hr.
Questions are about basic verilog and electronics concept.
Round 4: managerial hr.
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 2 giorni. Ho sostenuto un colloquio presso SmartDV Technologies (Bengaluru) nel mese di set 2023
Colloquio
The interview has 5 rounds of one on one interview, they asked basic to medium questions in digital,circuits,C,verilog,etc.thefirst round will be paper pen test with aptitude and some core questions.
Domande di colloquio [1]
Domanda 1
What is preprocessor in C? Like this they asked many questions.