Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 5 mesi. Ho sostenuto un colloquio presso TE Connectivity
Colloquio
During a career fair at my school, I expressed my interest in TE Connectivity. About 4 or 5 months later, I received a call about an opportunity to interview for a summer internship. I'll admit that I went into this interview as unprepared as I've ever been, at the time I was kinda overwhelmed with school, which is no excus.
Domande di colloquio [1]
Domanda 1
Have you ever had a team member who was not contributing his role and how did you handle it.
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso TE Connectivity nel mese di nov 2012
Colloquio
1.) On campus interview with alumni employees (late fall)
2.) 2nd round full day interview for multiple positions (nov-dec) - hotel and transport provided
3.) offer (2-3 weeks after #2)
4.) Deadline to accept (2 weeks after #3)
Over all it was structured and formal but the organizers were friendly and helpful. I would rate the competitiveness to get a job as a 3 out of 5 (5 being Boeing/Exxon and 1 being your uncles engineering company). The offer was also on par ($21/hr) with competitiveness.
Domande di colloquio [1]
Domanda 1
A few technical questions. Mainly strengths / materials basics (stress vs strain)
