Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso TSMC nel mese di dic 2020
Colloquio
First round interview with 4 Process Integration Engineers and second round with a manager. They both emphasized that the job will be stressful and asked questions pertaining to managing time and how I deal with stressful situations.
Domande di colloquio [1]
Domanda 1
What do you do when you know you can't meet a deadline?
Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso TSMC
Colloquio
Both interviews on Teams. First interview 30 minutes standard questions on conflict. Second interview mostly about experience from resume and why you want to work at the company. Straight forward interview.
Ho presentato la mia candidatura tramite segnalazione di un dipendente. La procedura ha richiesto 2 settimane. Ho sostenuto un colloquio presso TSMC (Phoenix, AZ) nel mese di gen 2026
Colloquio
Self Introduction for 5 minutes at first. Then they asked behavioral questions for 25 minutes. Then asked technical questions for 10 minutes. They mainly care about whether you are familiar with semiconductor device knowledge and fabrication process.
Ask academy background. If you can follow company’s strategy to relocate. Willing to do overtime since it’s gonna happened frequently. Overall it’s not too harsh. The point of the interview to check the personality more than your ability. Just to make sure you can get your job done under high pressure.
Domande di colloquio [1]
Domanda 1
Would your willing to relocate if company ask you to.
