Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso TSMC nel mese di mar 2021
Colloquio
first interview was more the technical background you have and details of your experience listed on your resume.
second interview (which I was mislead to be a more behavioral interview) was an indepth conceptual technical knowledge with the senior manager.
Domande di colloquio [1]
Domanda 1
Why do you soft bake your wafer? (what happens during this process)
Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso TSMC
Colloquio
Both interviews on Teams. First interview 30 minutes standard questions on conflict. Second interview mostly about experience from resume and why you want to work at the company. Straight forward interview.
Ho presentato la mia candidatura tramite segnalazione di un dipendente. La procedura ha richiesto 2 settimane. Ho sostenuto un colloquio presso TSMC (Phoenix, AZ) nel mese di gen 2026
Colloquio
Self Introduction for 5 minutes at first. Then they asked behavioral questions for 25 minutes. Then asked technical questions for 10 minutes. They mainly care about whether you are familiar with semiconductor device knowledge and fabrication process.
Ask academy background. If you can follow company’s strategy to relocate. Willing to do overtime since it’s gonna happened frequently. Overall it’s not too harsh. The point of the interview to check the personality more than your ability. Just to make sure you can get your job done under high pressure.
Domande di colloquio [1]
Domanda 1
Would your willing to relocate if company ask you to.
