Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 2 mesi. Ho sostenuto un colloquio presso TSMC (Phoenix, AZ) nel mese di apr 2025
Colloquio
I only had one round of interview in which I was interviewed by two managers. It was quite conversational and felt like a friendly discussion. I was not asked technical questions about engineering / semiconductor manufacturing. They dove deeply into my resume and wanted me to explain everything about my past experiences- definitely know your resume in-and-out!
It was 3 Video Essay questions through test gorilla. The position was for a visit day. The process was very slow, got ghosted and did not get rejection until the visit day has passed. wish they could've sped up the process
Domande di colloquio [1]
Domanda 1
Describe a time when you faced a technical challenge
Dna intership would recommend again fun tripo to taiwan you get acomodation and base salary though its hoot in summer would recommendround-trip flight tickets and assistance with your Intern Visa.
Applied to a summer internship programme in Taiwan as a foreign student
2 rounds of interview.
First round - shared personal experience and introduced to different departments
Second round - shared previous projects in AI/ML
Interviews were conducted in mandarin
