1st round- aptitude test included basic math and aptitude problems 2nd round- Offline face to face interview. Technical round- they asked qns from the topic which i said we didnt have in our syllabus 3rd round- HR round

The interview process was comprised of three rounds, including two technical interviews and one HR interview. The technical interviews were highly focused on core electronics concepts, particularly revolving around microprocessors and microcontrollers. These sessions tested not only theoretical knowledge but also practical understanding and problem-solving skills related to the design, architecture, and functionality of these key components. The interviewers delved deep into topics like instruction sets, interfacing, real-time applications, and debugging techniques, aiming to evaluate proficiency in handling intricate electronics challenges. Finally, the HR round assessed soft skills, cultural fit, and overall alignment with the organization's goals and values, completing the comprehensive evaluation process.