Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso TechnipFMC
Offerta accettata
Esperienza positiva
Colloquio nella media
Candidatura
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto una settimana. Ho sostenuto un colloquio presso TechnipFMC (Londra, Inghilterra) nel mese di nov 2017
Colloquio
I have applied through Campus. The interview took a week.First round was written which involve aptitude and core instrumentation question
second was face to face interview at their office in noida.
Domande di colloquio [2]
Domanda 1
Basically there were core instrumentation and measurement questions from venturimeter, orifice plate , coriolios meter etc.
Interview as a part of the campus hiring process. It was a two phased interview - one based on your company fit and another on your technical and analytical skills
First round is online test in Amcat having Aptitude, Reasoning, English, Core(Mechanical) . After clearing it next round is interview questions from Strength of materials, Heat transfer and our Resume.
Domande di colloquio [1]
Domanda 1
Strength of Materials, Heat transfer basics , GD&T .
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso TechnipFMC (Warangal) nel mese di ott 2019
