Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 6 settimane. Ho sostenuto un colloquio presso TechnipFMC (Mumbai) nel mese di nov 2019
Colloquio
I applied through College. Very good experience. The interviewer asked basics of all the subjects of mechanical in 4 years. Aptitude was tough, GD was non- eliminating, Tech round was tough, HR round was tough
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso TechnipFMC (Chennai) nel mese di ago 2023
Colloquio
Technical interview followed by HR round. The interviewers were very calm and also helped me when I couldn’t answer few questions. The only drawback was the fact that we were asked to assemble around 10Am in the morning but the actual interview started by 12:30pm.
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 2 giorni. Ho sostenuto un colloquio presso TechnipFMC (Hyderabad) nel mese di ago 2023
Colloquio
First assessment then technical round and then hr round
Interview is very supportive and they basically ask u about engineering subject , prepare well and u can pass it what should i say more
It is a mnc so u can understand
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto una settimana. Ho sostenuto un colloquio presso TechnipFMC (Campusa) nel mese di mar 2023
Colloquio
basics of mechanical core like types of beams, types of loads, shear force and bending moments, stress ,strain diagram etc. types of engineering materials, and also few questions about internship and few questions about thermodynamics