Ho presentato la mia candidatura online. La procedura ha richiesto 4 settimane. Ho sostenuto un colloquio presso Texas Instruments (Dallas, TX) nel mese di gen 2014
Colloquio
Telephone Interview with four members of the TI R&D materials division. They were very positive and personable but it seemed there was a mismatch in what they were looking for versus what the job description was asking for. Once the mismatch had been noted, they were still willing to continue answering questions about job opportunities in the materials development department.
Domande di colloquio [1]
Domanda 1
Can you describe viscoplastic and viscoeleastic behavior?
Ho sostenuto un colloquio presso Texas Instruments (Kuala Lumpur)
Colloquio
As an intern, the exposure is very good and the quick-paced environment promotes learning graph. Moreover, the seniors and technicians are friendly and willing to help and answer the questions.
Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso Texas Instruments nel mese di gen 2023
Colloquio
Short noticed but they are very accomodating with the inquiries. Nothing much about the technical questions. It is more like the "getting to know you" stage in the interview, but always be prepared. The people are nice and friendly working environment.
Domande di colloquio [1]
Domanda 1
How was your experienced working in a team setting?
Ho presentato la mia candidatura online. La procedura ha richiesto 4 settimane. Ho sostenuto un colloquio presso Texas Instruments (Santa Clara, CA) nel mese di dic 2022
Colloquio
One technical round with basic questions from your projects and the general processes in packaging and advanced packaging knowledge. It is a phone screen and then an interview - sometimes 2
Domande di colloquio [1]
Domanda 1
1. Project specific 2. Packaging knowledge 3. Fundamental coursework