Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso Valeo (Chennai) nel mese di giu 2023
Colloquio
Overall, a smooth campus placement offer process ensured that both the company and the candidates found suitable matches for their respective needs. The campus placement process typically starts with a pre-placement talk conducted by the company. Following the PPT, the company conducted an assessment round to evaluate the candidates' skills, knowledge, and problem-solving abilities. After the assessment round, shortlisted candidates are invited for a technical interview. Upon successfully clearing the technical interview, candidates proceed to the HR interview round. The HR interview aims to assess the candidate's communication skills, personality fit with the company culture, motivation, and overall suitability for the organization.
Domande di colloquio [1]
Domanda 1
Basic electronics and programming question related to projects on resume.
La procedura ha richiesto 3 giorni. Ho sostenuto un colloquio presso Valeo (Chennai) nel mese di feb 2023
Colloquio
I went to the office as it was an walk-in interview for graduate engineer trainee role. There was no job detailed description given. First there will be aptitude test. If you get shortlisted you will go through 3 more rounds. 2 technical round and one HR round.
Ho presentato la mia candidatura online. La procedura ha richiesto 3 giorni. Ho sostenuto un colloquio presso Valeo (Chennai) nel mese di ott 2022
Colloquio
Was all Good Three rounds - Aptitude - Technical - Advanced technical - HR Need to good in Design software tools like catia and need to so so good in technical like thermodynamics,fluid mechanics, strength of materials, etc..
