Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 2 mesi. Ho sostenuto un colloquio presso Vermont Information Processing (Mumbai) nel mese di ott 2023
Colloquio
i have appeared for vip through college placement in 2023 mumbai.
the interview process is of 3 technical round and 1 hr round
Technical round were easy to medium and question were mostly asked on oops, dbms, java, software development life cycle, puzzles, etc.
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Vermont Information Processing (Mumbai) nel mese di gen 2025
Colloquio
Easy to average difficulty process.
Five rounds in total. First is aptitude test, Second third and forth technical round and 5th is hr round . They also ask theory for dsa questions and sql too
Domande di colloquio [1]
Domanda 1
Geeks for geeks puzzle
Coding round -> 2 nd largest value in array