Ho presentato la mia candidatura tramite un'agenzia di reclutamento personale. La procedura ha richiesto 2 settimane. Ho sostenuto un colloquio presso WD (Bengaluru) nel mese di apr 2020
Colloquio
1st round telephonic screening, 3 technical rounds and 1 HR round.
Telephonic round was all the about the projects mentions in the resume.
1st technical round was on PCIe.
2nd was on SV and UVM.
3rd was SoC verificatio.
Domande di colloquio [1]
Domanda 1
Questions were asked from the resume about the work done.
PCIe specifics questions :-
1) How does autonomous width and speed change works in PCIe ?
2) Explain the enumeration process in PCIe?
3) What is hot plug?
4 round interview included two technical, one managerial and one HR interview. Technical interview will be little challenging and interesting. Managerial interview would be shorter and easy depending on the manager.
Ho presentato la mia candidatura tramite un'agenzia di reclutamento personale. La procedura ha richiesto 2 settimane. Ho sostenuto un colloquio presso WD (Bengaluru) nel mese di nov 2023
Colloquio
it was easy , basic technical ques and good interview process, stick to core concepts and easy apply and offer letter process, very good liked it very much, transparent and easy process
4 rounds, 3 technical and one with manager interaction.
finally one hr round. interaction was nice. team is good,.
what else should i write? oh my god this is really df dslgs
Domande di colloquio [1]
Domanda 1
emulation related questions
verilog questions
system verilog
verifcation
