Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso Wipro (Vāranāsi) nel mese di dic 2017
Colloquio
Technical Exam Followed by Tech Interview and finally HR.
Technical exam round included questions from Aptitude and Coding of moderate level .
There were two tech round and one HR round.The Two Tech round were the most difficult part of the whole placement process
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Wipro (Bengaluru)
Colloquio
Interview was very easy and to the point where the things that I had mentioned in my resume. Interview went very friendly. Project related questions were also asked and basics of oops
aptitude round followed by coding round of 2 question and then technical round was easy and then followed by HR round and over all experiences was good to me and it was a campus placement
Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso Wipro
Colloquio
Online Assessment and Business discussion round and Coding round were easy and logical questions and English speaking and essay writing and Mathematical questions and Communication skills and writing skills and body language